2026 IEEE CPMT Symposium Japan (ICSJ)

2026 IEEE CPMT Symposium Japan (ICSJ)

Exhibition Information
IEEE CPMT Symposium Japan (ICSJ) is a technical symposium focused on electronics packaging, component integration, and advanced manufacturing technologies. The event brings together researchers, engineers, academics, semiconductor manufacturers, electronics companies, and technology specialists. It provides a platform for presenting research findings, exchanging technical knowledge, and exploring innovations in electronic packaging and assembly. The symposium highlights developments in semiconductor packaging, advanced interconnection technologies, thermal management, reliability engineering, and miniaturisation. It supports collaboration between industry and academia, helping participants discuss emerging challenges and practical solutions for next-generation electronic devices. The event also offers opportunities to share technical expertise, establish professional connections, and explore advances that improve electronic system performance, reliability, and manufacturing efficiency.

Exhibition Categories
IEEE CPMT Symposium Japan covers a range of technologies related to electronic packaging, semiconductor assembly, and component manufacturing. Major subject areas include advanced semiconductor packaging, system-in-package technologies, three-dimensional integration, chiplet integration, and high-density interconnects. Other topics encompass printed circuit boards, substrate materials, bonding technologies, soldering, and electronic assembly processes. Thermal management, heat dissipation, electrical performance, and reliability testing are important technical areas. The symposium also addresses materials science, miniaturisation, power electronics packaging, flexible electronics, and emerging packaging architectures. Additional areas include inspection and testing methods, failure analysis, manufacturing process optimisation, and sustainable electronics manufacturing. These topics help researchers and industry professionals evaluate new technologies, improve product reliability, and develop advanced packaging solutions for semiconductor, telecommunications, automotive, and consumer electronics applications.